LED Technologies
SMD
Surface Mounted Device Technology
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The classic LED technology in which individual LED housings with three chips (RGB) are soldered onto a circuit board.
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Advantage: Easy to repair and replace modules.
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Disadvantage: Susceptible to damage, especially with small pixel pitches (e.g. LEDs can break off when touched).
SMD GOB
Glue-on-Board Technology
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Further development of SMD technology in which a transparent protective layer (epoxy or silicone) is poured over the LEDs.
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Advantage: Better protection against dust, moisture and mechanical stress.
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Disadvantage: Slightly reduced brightness due to the protective layer, more difficult to repair.
COB
Chip-on-Board Technology
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LEDs are placed directly on the substrate instead of being processed as separate components.
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Advantage: Better heat dissipation, fewer reflections, more compact design.
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Disadvantage: More expensive to manufacture and more difficult to repair, as individual LEDs cannot simply be replaced.
MIP
Full Flip Chip - Micro LED in Package
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LEDs are mounted as small units in a special package and then placed on the panel.
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Advantage: Very high pixel density, excellent brightness & color reproduction, robust construction.
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Disadvantage: Highly expensive and technologically complex, currently mainly suitable for premium applications.
LED technologies in comparison
Conclusion: Which technology for which application?
For flexible standard solutions in indoor & outdoor → SMD
If additional protection against environmental influences is required → SMD with GOBT
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When a robust but affordable fine-pitch solution is required → COB
When maximum resolution and future-proofing are required → MIP with full flip chip